8-Layer HDI PCB

Product Details
Customization: Available
Gold Member Since 2024

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Product Description

Item Manufacturing Capability
Material CEM-1, CEM-3, FR-4(Normal to high Tg), Halogen-free, High CTI, PolyImide(Flex), Metal Base, etc.
Layer Count Rigid: 1-16L;   Flex: 1-8L;   Rigid-flex: 2-6L
Thinnest Laminate 0.13mm(excluding Cu thickness)
Board Thickness Rigid: 0.25-6.0mm
Copper Thickness Max 6oz
Surface Finish HAL, ENIG,Immersion Silver/Tin, OSP, Flash Gold, Plated Hard Gold(Gold Finger)
Board Size Max 1200mm*520mm
Min Trace W/S 3/3mil
Min Finished Hole Size 0.1mm(Laser Drill); 0.2mm(Mechanical Drill)
Hole Size Tolerance PTH:+/-0.075mm; NPTH:+/-0.05mm
Aspect Ratio Max 12:1
Layer Misregistration ≤3mil
Outline Tolerance +/-0.1mm
Impedance Control Tolerance +/-10%
Peelable Soldermask Thickness ≥0.2mm

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